Staff Packaging Engineer

Skyworks is seeking a Staff Packaging Engineer preferably in Austin, TX or Nashua, NH, to support the growing RF and Mixed Signal Intelligence Business Unit.This role will provide package-engineering leadership for new product introduction and support package design, material selection, assembly readiness, qualification, and production release. The position spans SOIC, lead-frame, QFN, LGA, BGA, and WLCSP package technologies and requires close collaboration with R&D, device and process engineering, module design, program management, operations, internal assembly sites, and outsourced semiconductor assembly and test partners.

• Provide package-design support and material-selection guidance to enable high-yielding, reliable, and cost-effective products.
• Develop and introduce new packaging technologies while supporting existing and legacy products.
• Collaborate with cross-functional teams to confirm adherence to design and technology rules and to define technology choices, timelines, milestones, and deliverables for new product launches.
• Lead end-to-end product readiness and the transition from development to production release, coordinating Design, Process, Test, Operations, and Module teams to meet quality, performance, and schedule objectives.
• Work with Skyworks' internal assembly operation in Mexicali and external OSAT partners across Asia to support assembly-site selection, qualification, and execution.
• Lead product-readiness reviews covering technology, capability, capacity, and cost for each product release.
• Conduct design, process, and technology risk assessments and coordinate reliability activities throughout technology development, NPI, and ramp-up to support Cpk and yield targets.
• Identify risks and challenges in the NPI process and develop practical mitigation plans.
• Collaborate openly with cross-functional teams to manage projects, resolve technical and operational problems, and address critical issues.
• Prepare clear status reports and executive-level updates on product readiness, risks, decisions, and recovery actions.

• Bachelor's degree in Mechanical Engineering or a related engineering discipline, with 10+ years of relevant semiconductor packaging experience.
• Strong experience in new product introduction, package engineering, and package design for SOIC, QFN, lead-frame, LGA, BGA, and WLCSP semiconductor assemblies.
• Hands-on knowledge of semiconductor packaging assembly processes, including solder attach, die attach, wire bonding, overmolding, material curing, and BGA assembly.
• Experience applying relevant JEDEC, IATF, and AEC requirements to IC packaging and qualification.
• Strong knowledge of electronic packaging technologies, structures, materials, and processes, including EDS, die-stacking, SiP, MCM, WLCSP, and dual-sided packages.
• Experience with IC package modeling and simulation and with package-related failure analysis.
• Strong understanding of product development, manufacturing processes, and supply-chain management.
• Proven leadership, communication, and interpersonal skills, with the ability to work effectively in a multicultural and cross-functional environment.
• Knowledge of project-management principles and practices.
• Strong technical and interpersonal problem-solving and analytical skills.
• Excellent written, verbal, and presentation skills.
• Ability to work autonomously, stay organized, maintain attention to detail, and set high standards for execution.

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The successful candidate would be a technically credible packaging leader who can connect package architecture and assembly-process decisions to product performance, reliability, cost, capacity, and schedule. The role requires disciplined execution, clear decision-making, and the ability to influence teams and suppliers without direct authority.