New

Advanced Packaging Lamination & Bonding Engineer

SkyWater Technology
life insurance, paid time off, paid holidays, 401(k)
United States, Florida, Kissimmee
200 NeoCity Way (Show on map)
Jul 21, 2026
Bold Thinking. World Changing. At SkyWater, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life-saving medical devices, consumer electronics and American security require semiconductors. Working in our Minnesota headquarters, Florida, or Texas location - employees join together to improve the world. Explore what's possible. Joining our U.S. - based team means contributing to and learning about the commercialization of some of the most exciting technologies the world has ever seen. We are turning "science fiction" into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies. We manufacture products for aerospace and defense, medical, automotive, consumer and industrial markets, to name a few. Our customers include emerging leaders who rely on our intellectual property security and quality manufacturing services. Step into the future. SkyWater's values of Integrity, Excellence, Collaboration, Empowerment and Growth Mindset guide us to cultivate an empowered, learning environment. We also invest in developing highly skilled, dedicated employees - and employees who are entering the workforce for the first time, from the military, and a variety of educational backgrounds. Are you bold thinking? Find your place on our team and help us change the world! Position Summary: We are looking for a hardworking, passionate, and experienced Advanced Packaging Laminate and Bonding Process Engineer for our Florida Advanced Packaging site. This role will focus on Bonding and Lamination areas with owning and developing one or more critical process areas within our Advanced Packaging flow. Candidates with experience in semiconductor manufacturing, backendofline processing, or advanced packaging are well suited. In this role, you will lead, develop, and improve integrated process flows and collaborate closely with foundry customers, colleagues, and management. Strong communication skills are essential. Major Area of Accountability: * Lead new process development, transfer, and integration activities in a manufacturing environment. * Develop, optimize, and integrate robust manufacturable process recipes for Foundry customers in one or more key process areas. * Provide technical ownership for the assigned module, including process stability, tool performance, defectivity, consumables evaluation, and continuous improvement. * Support process integration for advanced packaging, MEMS, Photonic, or backendofline device flows. * Utilize metrology and characterization tools to evaluate process conditions and drive improvements. * Investigate and implement integration or processflow changes to improve device performance, reliability, and yield. * Work with process and equipment engineers to identify processing marginalities and implement corrective actions. * Monitor inline and endofline SPC charts for trends/excursions and drive databased corrective actions. * Support improvement of electrical test parametrics through process/integration modifications. * Opportunity to grow toward Project Management responsibilities, integrating customer device or process requests. * Perform other duties as assigned. Percentages of time spent on specific job duties may vary. Required Qualifications: Education: 7-10 years experience with BS, 5-7 years experience with MS, 2+ years experience with PhD Experience and Skills: Handson experience with fab processing tools in advanced packaging process area. Prior experience working with wafer bonding and metal carrier / RDL laminate. Develop and optimize materials and process recipes for wafer bonding and laminate steps to enable nextgeneration advanced packaging. Knowledge of MEMS/Photonic devices or backendofline integration is a plus. Strong understanding of DOE, SPC, and 6sigma concepts and their application. Clear, datadriven problemsolving capability with strong communication and documentation skills. Ability to work independently and in crossfunctional teams. US Citizenship Required: This position will require holding or the ability to obtain a government security clearance, which requires U.S. citizenship. The annual salary range for this role is $114,320 - $171,480. Pay offered is based on many factors including, but not limited to, the job-related experience, skills, education, and credentials of each candidate. SkyWater offers an exciting environment where the brightest semiconductor minds come together to achieve exceptional results. We offer competitive salary and an opportunity to participate in incentive plans as well other employee financial benefits including 401k match, life insurance and opportunities to purchase SkyWater stock at a discounted rate. Additionally, SkyWater offers a comprehensive benefits package which promotes a healthy life. This includes benefit eligibility day one, medical, dental, mental health benefits, vision, legal planning, short- and long-term disability, paid time off, paid holidays, an on-site fitness facility, and an on-site self-serve market. SkyWater complies with federal and state disability laws and makes reasonable accommodations for applicants and employees with disabilities unless doing so would cause an undue hardship. Alternative methods of applying for employment are available to individuals unable to submit an application through this site because of a disability. To request reasonable accommodations, to participate in the job application or interview process, to perform essential job functions, and/or to receive other benefits and privileges of employment, please contact Human Resources at 952-851-5200 or Recruiting@SkyWatertechnology.com. EOE, including disability/vets We will never ask applicants to pay fees, purchase equipment or gift cards, or provide financial information before a formal offer of employment has been accepted. If you receive a suspicious communication claiming to represent our company, please verify its authenticity by contacting our recruitment team at recruiting@skywatertechnology.com before responding.